Power chips are linked to exterior circuits with product packaging, and their efficiency relies on the support of the packaging. In high-power situations, power chips are usually packaged as power modules. Chip interconnection refers to the electrical link on the upper surface of the chip, which is normally aluminum bonding cord in standard components. ^
Traditional power module package cross-section
Presently, business silicon carbide power modules still mainly make use of the packaging technology of this wire-bonded traditional silicon IGBT component. They encounter issues such as big high-frequency parasitic criteria, not enough warm dissipation ability, low-temperature resistance, and not enough insulation stamina, which limit making use of silicon carbide semiconductors. The display screen of superb performance. In order to fix these troubles and fully make use of the massive prospective benefits of silicon carbide chips, many brand-new packaging modern technologies and services for silicon carbide power modules have actually emerged over the last few years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have established from gold cable bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually created from gold wires to copper cords, and the driving pressure is price reduction; high-power tools have actually established from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to improve product performance. The greater the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a strong copper bridge soldered to solder to attach chips and pins. Compared with standard bonding product packaging methods, Cu Clip innovation has the complying with advantages:
1. The link in between the chip and the pins is made of copper sheets, which, to a specific degree, replaces the typical cable bonding technique between the chip and the pins. As a result, an unique package resistance worth, greater present circulation, and better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can totally save the cost of silver plating and inadequate silver plating.
3. The product appearance is completely consistent with normal products and is mainly utilized in web servers, mobile computers, batteries/drives, graphics cards, motors, power materials, and other fields.
Cu Clip has two bonding approaches.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding approach is more costly and intricate, yet it can accomplish far better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus cable bonding method
The resource pad utilizes a Clip approach, and the Gate utilizes a Cord approach. This bonding method is a little more affordable than the all-copper bonding technique, conserving wafer area (applicable to very little gate areas). The process is less complex than the all-copper bonding approach and can obtain far better Rdson and much better thermal impact.
Supplier of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper electroplating, please feel free to contact us and send an inquiry.
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